Electronic Component Bonding

Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.

6,175 US filings from 1,327 companies since 2023 · 2023: 1,596 · 2024: 2,038 · 2025: 1,862 · 2026 YTD: 679

Welding & Soldering

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	Taiwan Semiconductor Manufacturing Company, Ltd.	235	43	80	92	20	+15.0%
2	SAMSUNG ELECTRONICS CO., LTD.	215	42	67	71	35	+6.0%
3	Adeia Semiconductor Bonding Technologies Inc.	158	35	55	49	19	-10.9%
4	Taiwan Semiconductor Manufacturing Co., Ltd.	141	27	51	57	6	+11.8%
5	Mitsubishi Electric Corporation	109	33	37	28	11	-24.3%
6	ROHM CO., LTD.	102	32	38	27	5	-28.9%
7	INTEL CORPORATION	100	21	33	39	7	+18.2%
8	Micron Technology, Inc.	94	19	37	25	13	-32.4%
9	TEXAS INSTRUMENTS INCORPORATED	90	21	37	25	7	-32.4%
10	NANYA TECHNOLOGY CORPORATION	80	25	33	18	4	-45.5%
11	Kulicke and Soffa Industries, Inc.	77	20	20	32	5	+60.0%
12	YAZAKI CORPORATION	77	10	26	28	13	+7.7%
13	TOKYO ELECTRON LIMITED	76	17	23	25	11	+8.7%
14	CANON KABUSHIKI KAISHA	70	14	20	28	8	+40.0%
15	FUJI ELECTRIC CO., LTD.	70	15	28	18	9	-35.7%
16	Sumitomo Wiring Systems, Ltd.	63	21	23	16	3	-30.4%
17	International Business Machines Corporation	62	22	21	17	2	-19.0%
18	DISCO CORPORATION	55	14	18	9	14	-50.0%
19	KABUSHIKI KAISHA TOSHIBA	54	13	16	23	2	+43.8%
20	SENJU METAL INDUSTRY CO., LTD.	54	16	14	15	9	+7.1%
21	Infineon Technologies AG	49	15	16	11	7	-31.2%
22	SHINKAWA LTD.	49	14	23	12	·	-47.8%
23	Sumitomo Electric Industries, Ltd.	48	14	20	11	3	-45.0%
24	TE Connectivity Solutions GmbH	48	5	17	19	7	+11.8%
25	Kioxia Corporation	47	24	11	8	4	-27.3%