Company patents
STMICROELECTRONICS (ROUSSET) SAS
STMICROELECTRONICS (ROUSSET) SAS's patent strategy shows a broad decline across its core semiconductor categories, with significant year-over-year drops in key areas like Transistor & Device Structure (-81.8% in 2025) and Memory & Storage (Static) (-42.1% in 2025), indicating a potential shift away from foundational semiconductor component innovation. The consistent decline in all listed categories, including a -90.9% drop in Computer Security patents so far in 2026, suggests a company-wide re-evaluation of its patenting priorities, with no emerging areas of rapid growth evident in its current portfolio.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
391 US filings (since 2023) · 12 categories · 34 themes
Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.
Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.
Design and implementation of non-traditional logic gates or memory elements, often leveraging new materials or device physics to achieve multi-functionality, adaptive thresholds, or higher density.
Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Techniques for designing and fabricating the conductive pathways (interconnects) and their contacts between different components within an integrated circuit, focusing on density, reliability, and performance.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.
Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.
Integrated circuits or sub-circuits designed to regulate, balance, or protect power delivery within a device, often involving specific transistor and capacitor arrangements.
Focuses on the physical construction and integration of electronic components, such as antennas, IC chips, and display elements, into smart cards or secure documents, often involving multi-layer structures and specialized materials.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Digital logic circuits designed to interface with analog sensors or signals, including comparators, input buffers, differential input stages, and logic for processing sensor outputs (e.g., capacitance, optical, touch) for detection or measurement.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Methods and circuits for detecting and mitigating defects, ensuring data integrity, and enabling self-testing and repair mechanisms within memory devices and subsystems.
Techniques and hardware architectures for optimizing the radio frequency (RF) front-end, antenna systems, and beamforming strategies in wireless networks to improve signal quality, capacity, and interference mitigation.
Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.
Novel hardware designs and processing pipelines tailored for specific computational tasks, such as graphics rendering, neural network operations, or matrix transformations, often involving custom circuits, memory arrays, or data flow mechanisms.
Systems and methods for uniquely identifying, tracking, and managing physical items using scannable codes (barcodes, QR codes) or wireless tags (RFID, IoT devices) to link physical objects to digital information, inventory, or services.
Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.
Design and operation of analog and mixed-signal circuits within the memory array, such as page buffers, sense amplifiers, and data latches, responsible for reading and writing data from/to memory cells.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Systems enabling wireless communication between vehicles (V2V), vehicles and infrastructure (V2I), or vehicles and other entities (V2X) to share information for traffic management, safety, and navigation.
Specialized digital and mixed-signal circuits for controlling and reading out quantum bits (qubits), including generating precise modulated RF signals and integrating with photonic components for quantum operations.
Systems and methods for authenticating users, devices, or applications, authorizing their access to resources based on policies, and managing digital identities across various platforms.
Applying artificial intelligence and machine learning techniques to enhance cryptographic systems, such as generating encryption models, improving zero-trust architectures, or enabling privacy-preserving computations like federated learning.
Techniques for protecting data at rest or in backup, ensuring its integrity, confidentiality, and verifiable origin, often involving encryption, unique identifiers, or secure repositories.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Patents
Showing 1-8 of 8
Quantum Control Circuits