Silicon Storage Technology, Inc.

A diode comprises a semiconductor substrate, an n-well formed in the semiconductor substrate, a p-well formed in the semiconductor substrate that is spaced apart from the n-well, a first isolation region formed in the n-well, a first electrode formed in direct contact with the n-well and formed of a metal material, a first heavily doped region formed in the n-well and having a dopant concentration greater than a dopant concentration of the n-well, a second electrode formed in direct contact with the first heavily doped region, a second isolation region formed in the semiconductor substrate and between the n-well and the p-well, a second heavily doped region formed in the p-well and having a dopant concentration greater than a dopant concentration of the p-well, and a third electrode formed in direct contact with the second heavily doped region.

A method of programming a memory cell having a floating gate by applying a first program pulse to the memory cell to place electrons on the floating gate, wherein the first program pulse comprises a program voltage that includes a preliminary voltage level in a first portion of the first program pulse and a first voltage level in a second portion of the first program pulse, wherein the first voltage level is greater than the preliminary voltage level. The first voltage level is applied immediately successive to the preliminary voltage level. Then, applying successive program pulses to the memory cell to place additional electrons on the floating gate, wherein the successive program pulses include the program voltage, and wherein the program voltage increases in voltage level for each one of the successive program pulses relative to a previous one of the successive program pulses or the first program pulse.

A method of programming a memory device comprising control gate lines, erase gate lines, select gate lines, source lines and bit lines connected to rows and columns of memory cells, the method comprising performing an erase operation that includes applying a first voltage to one of the erase gate lines, performing a pre-program operation that includes electrically connecting the one of the erase gate lines to a pair of the control gate lines to use positive charge on the one of the erase gate lines from the erase operation to pre-charge the pair of the control gate lines, and performing a program operation that includes applying a second voltage to the one of the erase gate lines and the pair of the control gate lines.

A method of programming memory cells that includes reading the memory cells to determine respective read currents for the memory cells. Respective ones of the memory cells are assigned to one of a plurality of groups of the memory cells, wherein respective ones of the plurality of groups of the memory cells are associated with a different range of read currents, such that the determined read current for a respective one of the memory cells is within the range of read currents for the group of the memory cells to which the memory cell is assigned. The memory cells are programmed using program currents that vary for respective ones of the memory cells depending upon the group of the memory cells to which the memory cell is assigned.

A semiconductor device comprising a first die and a second die. The first die comprises a first substrate, non-planar MOSFET devices formed on the first substrate, and first contact pads electrically connected to the non-planar MOSFET devices. The second die comprises a second substrate, planar MOSFET devices formed on the second substrate, and second contact pads electrically connected to the planar MOSFET devices. Insulation material is formed on the first and second substrates. Contacts are formed on the insulation material. Paths of conductive material extend through the insulation material, and electrically connect to respective ones of the contacts, the first contact pads and the second contact pads.

A method of programming a memory device comprising control gate lines, erase gate lines, select gate lines, source lines and bit lines connected to rows and columns of memory cells, the method comprising performing an erase operation that includes applying a first voltage to one of the erase gate lines, performing a pre-program operation that includes electrically connecting the one of the erase gate lines to a pair of the control gate lines to use positive charge on the one of the erase gate lines from the erase operation to pre-charge the pair of the control gate lines, and performing a program operation that includes applying a second voltage to the one of the erase gate lines and the pair of the control gate lines.

A method of programming memory cells that includes reading the memory cells to determine respective read currents for the memory cells. Respective ones of the memory cells are assigned to one of a plurality of groups of the memory cells, wherein respective ones of the plurality of groups of the memory cells are associated with a different range of read currents, such that the determined read current for a respective one of the memory cells is within the range of read currents for the group of the memory cells to which the memory cell is assigned. The memory cells are programmed using program currents that vary for respective ones of the memory cells depending upon the group of the memory cells to which the memory cell is assigned.