Company patents
Mattson Technology, Inc.
Mattson Technology, Inc.'s patent strategy is heavily concentrated in core semiconductor areas, with "Semiconductor Manufacturing Process" accounting for 67.2% of its portfolio. Surprisingly, despite this focus, patenting in "Electron / Ion Tubes & Discharge" has shown robust growth, increasing by 42.9% in 2024 and 15.0% in 2025, suggesting an emerging emphasis on this foundational technology, even as overall patenting activity so far in 2026 appears to be lower across most categories.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
116 US filings (since 2023) · 8 categories · 13 themes
Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.
Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Focuses on novel heating elements, power delivery, and thermal management for efficient and controlled aerosol generation. This includes resistive, inductive, and other heating methods, as well as heat distribution and retention.
Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.
Use of thermal and infrared sensors for non-contact temperature measurement, occupancy detection, structural health monitoring, fire/hazard detection, and process control in diverse industrial, environmental, and security applications.
Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.
Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Patents
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