CREELED, INC.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical connections adjacent the active LED structures. Exemplary contact structures include contacts electrically coupled to active LED structures and dielectric structures beneath the contacts. Dielectric structures are arranged beneath portions of the contacts while still allowing electrical connections therethrough. Such dielectric structures may be provided as regions of dielectric material with spacings that control topography of underlying bonding metals to reduce voiding.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly structures for LED packages with multiple LED chips are disclosed. LED package structures include arrangements of one or more of body structures with multiple cavities for LED chips, encapsulants with lenses registered with the multiple cavities, and lead frame structures at least partially within the body structures. Cavities of body structures and/or corresponding lenses are disclosed with certain asymmetries configured to direct highest intensities of LED chip emissions in directions that are offset from cavity centers. Body structures are disclosed with one or more continuously planar surfaces that promote enhanced flexibility in encapsulant and/or lead frame structures and improved resistance to moisture ingress. One or more combinations of cavities and/or lenses asymmetries may be implemented in combination with one or more continuously planar body surfaces.

Light-emitting diode (LED) devices and, more particularly, self-folding lead frames in LED packages are disclosed. Exemplary lead frame structures are provided that include relief lines formed in the lead frame structure that, in response to a force being applied to the lead frame structure, for example, when an LED chip is placed on the lead frame structure, cause the lead frame to self-fold into a predefined shape. The self-folding lead frame can provide the LED package with better manipulation of light control from the package itself than conventional lead frames, while simplifying the manufacturing process.

Light-emitting devices, and more particularly, LED chips that have pillars or pillar-like structures for plugged substrates are disclosed. Pillars can be formed of metal that plug into hollow vias of a substrate, enabling the LED chip to have electrical contact with a submount on which the substrate is mounted. The pillars can facilitate easier mounting of the LED chips to the submount in a surface mount device (SMD) context. The pillars can also serve as alignment pins to improve the die attach process. The substrate can include back-side metal contacts to facilitate the electrical contact between the pillars and the submount. In other embodiments, the hollow vias can extend all the way through the substrate allowing the pillars to make direct electrical contact with the submount.

Light-emitting diode (LED) components, and more particularly, LED components that have substrates with recessed cavities are disclosed for LED matrix applications. LED matrix applications involve an array of LEDs closely spaced together, resulting in conventional applications, an undesired level of crosstalk where light from one LED chip excites the phosphors and/or epitaxial layers on a neighboring LED chip. The present disclosure describes LED components with recessed cavities on a substrate, where the LED chips can be placed in the cavities, enabling the sidewalls of the cavities to prevent cross-talk between the LED chips in the LED matrix. The recessed cavities in the substrate can be used for flip-chip mounted chips or LED chips with vertical geometry. Additionally, an LED matrix can have recesses with varying depths to enable customized emission patterns.

Light-emitting diode (LED) packages, and more particularly arrangements of multiple LED chips in LED packages are disclosed. Arrangements include different types, different dimensions, and/or different orientations of LED chips within LED packages and corresponding electrical connections. Further arrangements include individual cover structures having different dimensions for various LED chips to accommodate thickness variations of LED chips and/or thickness variations attributed to different elements of individual cover structures. Different cover structure elements may include lumiphoric materials, antireflective layers, filter layers, and polarization layers. By accounting for dimensional variations between LED chips and/or between cover structures within multiple-chip LED packages, aggregate light-emitting surfaces may be provided with improved emission uniformity.

Light-emitting diode (LED) devices and more particularly LED devices with stress mitigation structures in lead frames for LED packages and related devices are disclosed. Stress mitigation structures include one or more leads that form floating bond pads for receiving at least one contact of a flip-chip LED. The floating bond pads are configured to be decoupled from bonding regions for corresponding LED packages. Leads that form floating bond pads are electrically coupled to other leads by way of electrical connectors with increased elasticity relative to the lead frame. During operation, transfer of stress associated with coefficient of thermal expansion differences between LED packages and associated mounting boards is reduced.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly cover structure arrangements for packaged LED devices are disclosed. Cover structures include light-absorbing layers configured to absorb certain wavelengths of light while permitting other wavelengths to pass therethrough. Light-absorbing layers may include pigment materials of colors that absorb intended wavelengths of light. In certain aspects, an LED package may include an LED chip configured to emit light of a first peak wavelength and a cover structure that includes a light-absorbing layer with a pigment of a color that absorbs the first peak wavelength. Such an arrangement may be useful for embodiments that also include a lumiphoric material that converts a portion of the first peak wavelength to light of a second peak wavelength. Cover structures may include one or more combinations of light-absorbing layers, antireflective layers, and reflective layers for providing improved emission characteristics for the LED package.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly microparticle arrangements in LED packages are disclosed. Microparticles and corresponding microparticle layers are structured to internally recirculate light received from an LED chip and/or a recipient lumiphoric material layer to promote increased color mixing and color over angle uniformity. Microparticles are structured with particle sizes that exceed wavelengths of light provided by LED chips and/or lumiphoric materials to elicit internal recirculating of light. Arrangements and/or particle sizes of microparticles are disclosed that tailor light recycling and color mixing to various applications with targeted emission patterns. Related methods include forming microparticles and corresponding microparticle layers before encapsulants of LED packages.

Light-emitting diode (LED) devices and more particularly arrangements of LED packages in LED devices and related methods are disclosed. LED devices include arrays of LED packages with spacings determined by grid structures. LED packages are partially finished before assembly into LED devices, thereby permitting individual testing and binning of LED packages before device assembly. Partially finished LED packages include primary encapsulants that partially fill recesses thereof to cover associated LED chips. During device assembly, overfill encapsulants are provided that cover the partially finished LED packages and fill portions of each recess above the primary encapsulants. Grid structures may remain as constituent elements in LED devices, or grid structures may be removed before providing overfill encapsulants.