Ayar Labs, Inc.

An optical fiber connector includes a lower plate having a plurality of optical fiber alignment structures. First and second guide element alignment structures are formed in the lower plate. A plurality of optical fibers are respectively disposed in the plurality of optical fiber alignment structures. First and second guide elements are respectively disposed within the first and second guide element alignment structures so as to extend outside of a periphery of the lower plate. A cover plate is secured to the lower plate to hold the plurality of optical fibers within the plurality of optical fiber alignment structures. An upper plate is disposed over each of the cover plate, the first guide element, and the second guide element. The upper plate is secured to the lower plate to hold the first and second guide elements within the first and second guide element alignment structures, respectively.

An optical coupling device includes an optical waveguide disposed on a substrate. An index of refraction of the optical waveguide is greater than an index of refraction of the substrate. The optical coupling device includes a cladding material disposed alongside and above the optical waveguide. An index of refraction of the cladding material is less than the index of refraction of the optical waveguide. The optical coupling device includes an optical buffering layer disposed within the cladding material above the optical waveguide. The optical buffering layer has an index of refraction greater than the index of refraction of the cladding material. The optical buffering layer is positioned a distance away from a top surface of the optical waveguide so as to guide an input optical mode at controlled vertical level relative to the optical waveguide, with the input optical mode overlapping the optical waveguide.

A strip-loaded optical waveguide includes a slab layer, a strip layer, and a cladding region. The slab layer has a first optical refractive index and a first width measured in a transverse direction that is perpendicular to a light propagation direction through the strip-loaded optical waveguide. The strip layer is disposed above the slab layer. The strip layer has a second optical refractive index and a second width as measured the transverse direction. The second width is less than the first width of the slab layer. The second optical refractive index is less than the first optical refractive index of the slab layer. The cladding region is disposed above the slab layer and above the strip layer. The cladding region has a third optical refractive index that is less than the second optical refractive index of the strip layer.

An electro-optical chip includes a plurality of transmit macros, each of which includes an optical waveguide and a plurality of ring resonators positioned along the optical waveguide. An optical distribution network is implemented onboard the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network conveys a portion of light received at each and every one of the plurality of optical inputs to each of the plurality of optical outputs, such that light conveyed to each of the plurality of optical outputs includes all wavelengths of light conveyed to the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros. The electro-optical chip is optically connected to a remote optical power supply.

A photonic system includes an optical coupling interface for an optical fiber disposed on a first surface of a support material and a PIC die/chip disposed on a second surface of the support material that is opposite from the first surface of the support material. An optical reflector structure is disposed within an opening formed through the PIC die/chip. The optical reflector structure is configured to receive a light beam from an optical waveguide within the PIC die/chip and turn the light beam toward the second surface of the support material and toward the optical coupling interface for the optical fiber. The light beam travels in a first direction from the optical waveguide within the PIC die/chip to the optical reflector structure, and then in a second direction through the opening in the PIC die/chip, and then through the support material to the optical coupling interface for the optical fiber.

A photonic system includes an optical coupling interface for an optical fiber disposed on a first surface of a support material and a PIC die/chip disposed on a second surface of the support material that is opposite from the first surface of the support material. An optical reflector structure is disposed within the PIC die/chip. The optical reflector structure is configured to receive a light beam from an optical waveguide within the PIC die/chip and turn the light beam toward the second surface of the support material and toward the optical coupling interface for the optical fiber. The light beam travels in a first direction from the optical waveguide within the PIC die/chip through the optical reflector structure, and then in a second direction through the optical reflector structure, and then through the overall thickness of the support material to reach the optical coupling interface for the optical fiber.

A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual kerf region of the electro-optical die interfaces with the redistribution layer to prevent mold compound material from entering into the optical fiber alignment structures and the cavity. The carrier wafer is removed from the redistribution layer. The redistribution layer and the mold compound material are cut to obtain an electro-optical chip package that includes the electro-optical die. The cutting removes the residual kerf region from the electro-optical die to expose the plurality of optical fiber alignment structures and the cavity at an edge of the electro-optical chip package.

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

A photonic system includes an optical coupling interface for an optical fiber disposed on a first surface of a support material and a PIC die/chip disposed on a second surface of the support material that is opposite from the first surface of the support material. The PIC die/chip includes an oxide stack, where a portion of the oxide stack is configured as an optical reflector structure that includes a reflecting surface configured to direct a light beam conveyed from an optical waveguide within the PIC die/chip from a first direction of travel to a second direction of travel directed toward the second surface of the support material and toward the optical coupling interface for the optical fiber disposed on the first surface of the support material. The light beam travels through the optical reflector structure and through the support material to reach the optical coupling interface for the optical fiber.

A thermo-optic phase shifter includes a substrate having a cavity formed into an upper region of the substrate. The thermo-optic phase shifter includes an optical waveguide disposed above the substrate. The optical waveguide extends across and above the cavity. The thermo-optic phase shifter also includes a heater device disposed along a lateral side of the optical waveguide. The heater device extends across and above the cavity. The cavity is formed by an undercut etching process after the optical waveguide and the heater device is formed. The optical waveguide can be formed to include one or more segments that pass over the cavity. Also, a second heater device can be included such that the one or more segments of the optical waveguide that extend over the cavity are bracketed by heater devices. Thermal transmission structures can be included to enhance heat transfer between the heater device(s) and the optical waveguide.