Company patents
AURAS TECHNOLOGY CO., LTD.
AURAS TECHNOLOGY CO., LTD.'s patent strategy reveals a significant and surprising shift away from its core focus, with its dominant 'Printed Circuits & Electronic Assemblies' category, representing 88.7% of its portfolio, experiencing a sharp decline of -66.7% so far in 2026, following substantial drops in previous years. This broad decline across most categories, including 'Heat Exchangers (Specific Types)' (-80.0% in 2025) and 'Heat Exchange Components' (-100.0% so far in 2026), suggests a dramatic re-evaluation of its R&D priorities, with only a minor uptick in 'Heat Exchangers (Specific Types)' (+100.0% so far in 2026) providing a small counter-trend.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
53 US filings (since 2023) · 7 categories · 9 themes
Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.
Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.
Design and optimization of fin structures, baffles, and surface textures within heat exchangers to increase heat transfer area, promote turbulence, or manage fluid flow for improved thermal performance.
Patents
Showing 1-10 of 13
Internal Flow Path Optimization