Company patents

AURAS TECHNOLOGY CO., LTD.

AURAS TECHNOLOGY CO., LTD.'s patent strategy reveals a significant and surprising shift away from its core focus, with its dominant 'Printed Circuits & Electronic Assemblies' category, representing 88.7% of its portfolio, experiencing a sharp decline of -66.7% so far in 2026, following substantial drops in previous years. This broad decline across most categories, including 'Heat Exchangers (Specific Types)' (-80.0% in 2025) and 'Heat Exchange Components' (-100.0% so far in 2026), suggests a dramatic re-evaluation of its R&D priorities, with only a minor uptick in 'Heat Exchangers (Specific Types)' (+100.0% so far in 2026) providing a small counter-trend.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

53 US filings (since 2023) · 7 categories · 9 themes

Advanced Heat Exchanger Architectures

Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.

Heat Exchangers (Specific Types)Heat Exchange Components
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44since 2023
-38.5%YoY
Two-Phase Cooling Devices

Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.

Heat Exchangers (Specific Types)Heat Exchange Components
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43since 2023
-18.2%YoY
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Packaging & Encapsulation
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40since 2023
-25.0%YoY
Internal Flow Path Optimizationfiltered

Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.

Heat Exchangers (Specific Types)
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7since 2023
-66.7%YoY
Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Printed Circuits & Electronic Assemblies
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3since 2023
0.0%YoY
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
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3since 2023
0.0%YoY
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
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2since 2023
new
Flexible/Foldable Device Structures

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Hardware Platform (Cooling, Power, Packaging)
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2since 2023
new
Enhanced Surface Fin Geometries

Design and optimization of fin structures, baffles, and surface textures within heat exchangers to increase heat transfer area, promote turbulence, or manage fluid flow for improved thermal performance.

Heat Exchange Components
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1since 2023
n/a

Patents

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