Temporary Wafer Bonding & Debonding

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

5,489 US filings from 1,084 companies since 2023 · 2023: 1,426 · 2024: 1,732 · 2025: 1,794 · 2026 YTD: 537

Chip-to-Chip Interconnect (Bonding, Bumps)Semiconductor Manufacturing Process

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	Taiwan Semiconductor Manufacturing Company, Ltd.	269	58	89	99	23	+11.2%
2	DISCO CORPORATION	255	71	73	92	19	+26.0%
3	TOKYO ELECTRON LIMITED	233	49	66	92	26	+39.4%
4	Taiwan Semiconductor Manufacturing Co., Ltd.	209	50	74	75	10	+1.4%
5	SAMSUNG ELECTRONICS CO., LTD.	170	39	47	64	20	+36.2%
6	Applied Materials, Inc.	130	27	46	44	13	-4.3%
7	Adeia Semiconductor Bonding Technologies Inc.	116	29	36	34	17	-5.6%
8	NITTO DENKO CORPORATION	110	35	41	21	13	-48.8%
9	Resonac Corporation	81	6	22	38	15	+72.7%
10	3M Innovative Properties Company	74	21	20	27	6	+35.0%
11	TEXAS INSTRUMENTS INCORPORATED	71	25	20	20	6	0.0%
12	Taiwan Semiconductor Manufacturing Company Limited	69	14	22	28	5	+27.3%
13	INTEL CORPORATION	68	12	25	29	2	+16.0%
14	Micron Technology, Inc.	64	9	26	24	5	-7.7%
15	NGK INSULATORS, LTD.	59	17	17	22	3	+29.4%
16	CANON KABUSHIKI KAISHA	57	8	18	25	6	+38.9%
17	NISSAN CHEMICAL CORPORATION	57	8	15	20	14	+33.3%
18	Kulicke and Soffa Industries, Inc.	51	16	12	23	·	+91.7%
19	Infineon Technologies AG	49	21	12	10	6	-16.7%
20	Lam Research Corporation	48	13	13	19	3	+46.2%
21	Tesa SE	47	8	23	8	8	-65.2%
22	Kioxia Corporation	45	18	16	7	4	-56.2%
23	ASM IP Holding B.V.	42	13	10	16	3	+60.0%
24	LINTEC CORPORATION	42	11	6	17	8	+183.3%
25	Soitec	42	12	16	11	3	-31.2%