Interconnect Materials & Reliability

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

5,226 US filings from 850 companies since 2023 · 2023: 1,506 · 2024: 1,562 · 2025: 1,690 · 2026 YTD: 468

Chip-to-Chip Interconnect (Bonding, Bumps)

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	SAMSUNG ELECTRONICS CO., LTD.	898	197	244	342	115	+40.2%
2	Taiwan Semiconductor Manufacturing Company, Ltd.	250	76	73	82	19	+12.3%
3	INTEL CORPORATION	243	76	70	84	13	+20.0%
4	TEXAS INSTRUMENTS INCORPORATED	133	32	45	46	10	+2.2%
5	Micron Technology, Inc.	126	42	42	29	13	-31.0%
6	Taiwan Semiconductor Manufacturing Co., Ltd.	125	37	38	47	3	+23.7%
7	Mitsubishi Electric Corporation	119	36	36	34	13	-5.6%
8	FUJI ELECTRIC CO., LTD.	101	32	31	29	9	-6.5%
9	ROHM CO., LTD.	96	38	29	26	3	-10.3%
10	Adeia Semiconductor Bonding Technologies Inc.	91	24	26	31	10	+19.2%
11	International Business Machines Corporation	79	25	19	29	6	+52.6%
12	Taiwan Semiconductor Manufacturing Company Limited	68	18	16	30	4	+87.5%
13	SHINKO ELECTRIC INDUSTRIES CO., LTD.	61	19	20	18	4	-10.0%
14	Applied Materials, Inc.	60	15	23	17	5	-26.1%
15	Resonac Corporation	58	7	21	25	5	+19.0%
16	NANYA TECHNOLOGY CORPORATION	57	17	19	19	2	0.0%
17	InnoLux Corporation	56	19	17	16	4	-5.9%
18	CHANGXIN MEMORY TECHNOLOGIES, INC.	55	23	12	19	1	+58.3%
19	Infineon Technologies AG	52	19	16	16	1	0.0%
20	ASM IP Holding B.V.	41	14	9	16	2	+77.8%
21	KABUSHIKI KAISHA TOSHIBA	41	14	9	15	3	+66.7%
22	DENSO CORPORATION	40	11	11	16	2	+45.5%
23	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC	38	11	11	14	2	+27.3%
24	SK hynix Inc.	38	10	8	11	9	+37.5%
25	RENESAS ELECTRONICS CORPORATION	36	13	8	11	4	+37.5%