Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

7,197 US filings from 1,654 companies since 2023 · 2023: 1,878 · 2024: 2,195 · 2025: 2,169 · 2026 YTD: 955

Hardware Platform (Cooling, Power, Packaging)Printed Circuits & Electronic Assemblies

Top companies

Ranked by filings in this theme since 2023. 2026 is partial.

#	Company	Since 2023	2023	2024	2025	2026 YTD	YoY
1	SAMSUNG ELECTRONICS CO., LTD.	518	130	145	168	75	+15.9%
2	Apple Inc.	314	97	97	92	28	-5.2%
3	Samsung Display Co., Ltd.	275	76	71	83	45	+16.9%
4	DELL PRODUCTS L.P.	216	56	60	72	28	+20.0%
5	InnoLux Corporation	127	37	32	48	10	+50.0%
6	HONOR DEVICE CO., LTD.	120	9	41	43	27	+4.9%
7	CORNING INCORPORATED	96	31	37	22	6	-40.5%
8	COMMSCOPE TECHNOLOGIES LLC	94	30	29	32	3	+10.3%
9	INTEL CORPORATION	89	11	29	27	22	-6.9%
10	LENOVO (SINGAPORE) PTE. LTD.	86	16	24	31	15	+29.2%
11	Huawei Technologies Co., Ltd.	85	16	29	27	13	-6.9%
12	Murata Manufacturing Co., Ltd.	65	22	21	17	5	-19.0%
13	QUANTA COMPUTER INC.	65	17	20	16	12	-20.0%
14	HITACHI ASTEMO, LTD.	56	11	20	21	4	+5.0%
15	Wistron Corporation	56	20	15	18	3	+20.0%
16	Getac Technology Corporation	50	18	11	17	4	+54.5%
17	WISTRON CORP.	48	16	19	11	2	-42.1%
18	AGC Inc.	46	15	11	15	5	+36.4%
19	ADVANCED SEMICONDUCTOR ENGINEERING, INC.	45	12	13	14	6	+7.7%
20	GOOGLE LLC	45	14	13	12	6	-7.7%
21	Fulian Precision Electronics (Tianjin) Co., LTD.	44	10	14	14	6	0.0%
22	LG ELECTRONICS INC.	42	7	15	14	6	-6.7%
23	Panasonic Intellectual Property Management Co., Ltd.	42	13	15	6	8	-60.0%
24	International Business Machines Corporation	41	15	13	9	4	-30.8%
25	BOE Technology Group Co., Ltd.	40	10	13	11	6	-15.4%