← All themes3D Die Stacking & Vertical Interconnects
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
28,391 US filings from 1,114 companies since 2023 · 2023: 6,178 · 2024: 8,206 · 2025: 9,843 · 2026 YTD: 4,164
Chip-to-Chip Interconnect (Bonding, Bumps)Multi-Chip & 3D AssembliesSemiconductor Packaging & EncapsulationMemory Devices (Structural)Semiconductor Diodes & Transistors
Top companies
Ranked by filings in this theme since 2023. 2026 is partial.
| # | Company | Since 2023 | 2023 | 2024 | 2025 | 2026 YTD | YoY |
|---|
| 1 | Taiwan Semiconductor Manufacturing Company, Ltd. | 5,002 | 1,005 | 1,416 | 1,924 | 657 | +35.9% |
| 2 | SAMSUNG ELECTRONICS CO., LTD. | 4,576 | 883 | 1,295 | 1,548 | 850 | +19.5% |
| 3 | Taiwan Semiconductor Manufacturing Co., Ltd. | 1,875 | 390 | 519 | 772 | 194 | +48.7% |
| 4 | INTEL CORPORATION | 1,837 | 472 | 507 | 621 | 237 | +22.5% |
| 5 | Micron Technology, Inc. | 1,241 | 354 | 389 | 342 | 156 | -12.1% |
| 6 | SK hynix Inc. | 1,194 | 250 | 363 | 356 | 225 | -1.9% |
| 7 | International Business Machines Corporation | 949 | 186 | 240 | 342 | 181 | +42.5% |
| 8 | YANGTZE MEMORY TECHNOLOGIES CO., LTD. | 904 | 232 | 279 | 269 | 124 | -3.6% |
| 9 | Kioxia Corporation | 627 | 176 | 211 | 148 | 92 | -29.9% |
| 10 | NANYA TECHNOLOGY CORPORATION | 553 | 116 | 167 | 185 | 85 | +10.8% |
| 11 | TEXAS INSTRUMENTS INCORPORATED | 430 | 114 | 131 | 133 | 52 | +1.5% |
| 12 | Taiwan Semiconductor Manufacturing Company Limited | 396 | 97 | 101 | 162 | 36 | +60.4% |
| 13 | CHANGXIN MEMORY TECHNOLOGIES, INC. | 377 | 113 | 123 | 110 | 31 | -10.6% |
| 14 | SANDISK TECHNOLOGIES LLC | 303 | 91 | 157 | 51 | 4 | -67.5% |
| 15 | QUALCOMM Incorporated | 262 | 54 | 46 | 110 | 52 | +139.1% |
| 16 | TOKYO ELECTRON LIMITED | 227 | 87 | 50 | 72 | 18 | +44.0% |
| 17 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 191 | 62 | 65 | 51 | 13 | -21.5% |
| 18 | Applied Materials, Inc. | 191 | 47 | 54 | 58 | 32 | +7.4% |
| 19 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 177 | 37 | 66 | 56 | 18 | -15.2% |
| 20 | MACRONIX International Co., Ltd. | 175 | 52 | 49 | 54 | 20 | +10.2% |
| 21 | UNITED MICROELECTRONICS CORP. | 169 | 24 | 27 | 77 | 41 | +185.2% |
| 22 | Monolithic 3D Inc. | 154 | 52 | 57 | 30 | 15 | -47.4% |
| 23 | Advanced Micro Devices, Inc. | 152 | 29 | 41 | 61 | 21 | +48.8% |
| 24 | Sandisk Technologies, Inc. | 152 | · | 4 | 91 | 57 | +2175.0% |
| 25 | Adeia Semiconductor Bonding Technologies Inc. | 143 | 28 | 44 | 52 | 19 | +18.2% |