ASML Netherlands B.V.

A method includes generating pattern data including common chip design data and one or more bit spaces or place holders reserved for non-common chip design data or information related to the non-common chip design data. The method includes introducing the non-common chip design data or information related to the non-common chip design data into the one or more bit spaces or place holders of the pattern data before streaming the pattern data to the maskless pattern writer. The common chip design data defines a common design layout part of an electronic device to be created on a wafer using the maskless pattern writer. The non-common chip design data defines a non-common design layout part of the electronic device to be created on the wafer using the maskless pattern writer, the non-common design layout part being different from other electronic devices created on the wafer.

An apparatus comprising a set of pixels configured to shape a beamlet approaching the set of pixels and a set of pixel control members respectively associated with each of the set of pixels, each pixel control member being arranged and configured to apply a signal to the associated pixel for shaping the beamlet.

A method of determining a measurement recipe for measurement of in-die targets located within one or more die areas of an exposure field. The method includes obtaining first measurement data relating to measurement of a plurality of reference targets and second measurement data relating to measurement of a plurality of in-die targets, the targets having respective different overlay biases and measured using a plurality of different acquisition settings for acquiring the measurement data. One or more machine learning models are trained using the first measurement data to obtain a plurality of candidate measurement recipes, wherein the candidate measurement recipes include a plurality of combinations of a trained machine learned model and a corresponding acquisition setting; and a preferred measurement recipe is determined from the candidate measurement recipes using the second measurement data.

A method includes detecting data associated with a patterning device and/or a lithographic apparatus, performing an action from a plurality of actions when a determination not to proceed is made, and performing the action on the patterning device and/or a lithographic apparatus.

An optical apparatus is disclosed, the apparatus comprising an optical element having a reflective surface for reflecting incident radiation in a beam path, and at least one sensor configured to sense radiation corresponding to a temperature of a respective portion of a backside surface of the optical element. Also disclosed is a method of controlling a temperature of a reflective surface of an optical element in a lithographic apparatus.

A micromirror array comprises a substrate, a plurality of mirrors for reflecting incident light and, for each mirror of the plurality of mirrors, at least one piezoelectric actuator for displacing the mirror, wherein the at least one piezoelectric actuator is connected to the substrate. The micromirror array further comprises one or more pillars connecting the mirror to the at least one piezoelectric actuator. Also disclosed is a method of forming such a micromirror array. The micromirror array may be used in a programmable illuminator. The programmable illuminator may be used in a lithographic apparatus and/or in an inspection and/or metrology apparatus.

A transmissive diffraction grating for a phase-stepping measurement system for determining an aberration map for a projection system comprises an absorbing layer. The diffraction grating is for use with radiation having a first wavelength (for example (EUV radiation). The absorbing layer is provided with a two-dimensional array of through-apertures. The absorbing layer is formed from a material which has a refractive index for the radiation having the first wavelength in the range 0.% to 1.04.

A charged particle assessment tool includes: an objective lens configured to project a plurality of charged particle beams onto a sample, the objective lens having a sample-facing surface defining a plurality of beam apertures through which respective ones of the charged particle beams are emitted toward the sample; and a plurality of capture electrodes adjacent respective ones of the beam apertures and configured to capture charged particles emitted from the sample.

In an integrated displacement sensor, a light source beam is guided along a plane, and at least part of said beam is received at an emission grating and diffracted away from the plane to form an emission beam. A target grating arranged on an object of interest receives the emission beam, which is diffracted thereupon to form zero order, first order and minus first order diffraction beams. Two first order couplers form planar first and minus first order diffraction beams. A zero order coupler forms a planar zero order diffraction beam; a first and minus first order combining device generates at least one first diffraction order interference optical signal; a zero order combining device generates a zero diffraction order interference optical signal using the planar zero order diffraction beam and a reference part of the light source beam; optical sensors receive diffraction order interference optical signals and generate output signals.

A method for aligning a measured image of a pattern printed on a substrate with a design layout. The method includes: obtaining a design layout of a pattern to be printed on a substrate and a measured image of the pattern printed on the substrate; performing a simulation process to generate a plurality of simulated contours of the design layout for a plurality of process conditions of a patterning process; identifying a set of disfavored locations based on the simulated contours; and performing an image alignment process to align the measured image with a selected contour of the simulated contours using locations other than the set of disfavored locations.